QFN Separation Technology | Punch-Type QFN vs Grinding Wheel Dicing
QFN Traditional Separation Technology
Currently, there are two main methods for separating individual QFN (Quad Flat No-Lead) packages.
The first method is milling machine separation, which was widely used in the early stage. However, due to its poor processing quality and low yield rate, this technique has been gradually eliminated.
The second method is punch-type QFN separation, which uses punching equipment to cut and separate QFN packages. During the punching process, different QFN products require corresponding molds. Each QFN chip must be aligned with the proper mold position before being separated by stamping. As a result, punch-type QFN has relatively high requirements for mold design, and different QFN sizes need dedicated molds.
For QFN chips with I/O terminals exposed on the component side, punch-type separation shows significant advantages. The punching process uses cutting blades with 30° and 5° angles, resulting in smooth and precise cross-sections of the copper material.
QFN Dicing Technology with Grinding Wheel
Traditional QFN cutting and separation methods face multiple limitations, including low processing accuracy, poor cutting consistency, and low production efficiency. Punch-type QFN separation also requires the development of dedicated molds, which increases extra mold development costs.
With the rapid growth of QFN package applications, these traditional separation methods are no longer sufficient to meet modern production demands. Therefore, a new processing method is urgently needed to replace them.
One advanced solution is the QFN grinding wheel dicing technology. This technique adopts wafer-like dicing equipment, similar to the process used in semiconductor manufacturing. It has already been widely applied in fields such as silicon integrated circuits, LEDs, lithium niobate, piezoelectric ceramics, and gallium arsenide materials.
Compared to traditional methods, QFN grinding wheel cutting technology provides higher accuracy, better consistency, and improved production efficiency, making it an ideal alternative for next-generation QFN package separation.