Comparative Analysis of Two Plasma Cleaning Technologies in Semiconductor Wire Bonding: Batch Type vs. In-line In the semiconductor packaging process, particularly in wire bonding, pre-bond cleaning is a critical step that directly determines bonding reliability. Any residual organic contaminants, micro-particles, or metal oxides on the chip or wafer surface may lead to weak bonds, insufficient…

Translated Content Common Wirebonding Problems and Corrective Actions in IC Packaging Wirebonding is a critical step in semiconductor packaging, including QFN packages and other leadframe-based designs. However, common process issues may occur, affecting bond quality and long-term device reliability. Below we summarize typical wirebonding problems, their influencing factors, and recommended corrective measures. 1. Ball Over-Squeeze…

1. Introduction Molded plastic packaging has long dominated the semiconductor packaging industry due to its cost-effectiveness, mature process, and scalability. However, as chip integration continues to advance, package dimensions shrink (with QFN packages demanding higher dimensional accuracy), and lead-free soldering processes impose stricter requirements on thermal resistance, plastic-encapsulated devices face three major challenges: Ultimately, these…

Flip-Chip Technology: A Comprehensive Analysis This report provides a comprehensive and in-depth analysis of Flip-Chip technology, highlighting its critical role as a modern high-performance interconnect solution. It begins by examining the fundamental principles and process flow of Flip-Chip, along with its fundamental advantages over traditional wire bonding. It then explores strategic applications in high-performance computing…

3.5D Packaging Technology Helps Optimize AI Training Costs In AI training scenarios, 3.5D packaging technology provides effective solutions for cost reduction across hardware design, manufacturing processes, energy consumption, and long-term operations. Its core advantages lie in transforming traditional packaging approaches and enhancing system-level efficiency. I. Efficient Control of Hardware Design and Manufacturing Costs 1. Modular…

Fish Tail Tear in Wire Bonding Process: Causes and Solutions Definition:In the wire bonding (Wirebond) process, fish tail tear refers to a defect where the bonding wire (commonly gold wire or copper wire) develops a tail-like tear or deformation at the ball bond or wedge bond end. This defect can significantly impact bond strength and…

1. Core Causes of Lead Frame Discoloration Lead frames in semiconductor packaging serve as key components for connection and support. Their surface condition significantly affects device performance and reliability. During the actual production process, lead frames often undergo discoloration due to various factors, which not only affect their appearance but may also damage electrical connections….

Via-in-Pad Technology in Chip Packaging: Definition, Applications, Advantages, and Limitations 1. Definition and Classification of “Via in Pad” “Via in Pad” refers to drilling vias directly on the surface-mount component pads in order to connect to internal PCB traces. The core purpose is to replace traditional fan-out routing or peripheral wiring by creating a direct…

Why QFN Packaging is Widely Preferred in the Chip Industry The semiconductor industry value chain can typically be divided into three core areas: chip packaging and testing, circuit design, and wafer manufacturing, with chip packaging and testing falling into the backend of the industry chain. Among various types of surface mount packaging, QFN (Quad Flat…

QFN Traditional Separation Technology Currently, there are two main methods for separating individual QFN (Quad Flat No-Lead) packages. The first method is milling machine separation, which was widely used in the early stage. However, due to its poor processing quality and low yield rate, this technique has been gradually eliminated. The second method is punch-type…