Wire Bonding Basics – Principles of Wirebond Technology for Semiconductor & QFN Packages
1. Basic Principle of Wire BondingIn modern electronic manufacturing, wire bonding is the most widely used interconnection method. It relies on solid-state welding, which means that metals are bonded together without reaching their melting temperature. This process is especially critical in semiconductor packaging, including advanced formats such as QFN packages. 2. Four Fundamental Factors of…