1. DIP (Dual In-line Package) Features: Leads extend from both sides in parallel rows and can be directly inserted into PCB holes.Advantages: Easy manual soldering and replacement; high mechanical strength.Disadvantages: Large size, not suitable for high-density assembly.Applications: Early microprocessors and memory chips; now mainly used for prototyping. 2. SOP / SOIC (Small Outline Package /…

Front of Line (FOL) – QFN Packaging Early Stage 1. Wafer Incoming Quality Assurance (IQC) – First Optical Inspection 2. Wafer Backgrinding (BG) 3. Wafer Mounting (Dicing Tape Application) Protective dicing tape applied before wafer sawing. 4. Wafer Dicing (Sawing) 5. Second Optical Inspection 6. Die Attach (Die Bonding) 7. Epoxy Cure (Baking) 8. Wire…

1. Physical Advantages: Ultra-Thin and Compact 2. Performance Advantages: Stable and Reliable 3. Cost Advantages: High Cost-Performance Ratio Typical Application ScenariosQFN packaging is widely adopted in Bluetooth chips, PMIC power management ICs, audio chips, RF power amplifiers, and clock chips, among other applications.