What Are Tin Whiskers? Tin whiskers are hair-like crystalline structures that spontaneously grow from the surface of tin. To understand tin whiskers, we must first explain “metal whiskers.” A whisker is a filament-shaped crystal that naturally grows from the surface of solid metals. They can appear on many metals, most commonly tin, cadmium, zinc, antimony,…
What is Formic Acid Reflow? Formic Acid Reflow is a specialized semiconductor packaging process that utilizes formic acid (HCOOH) vapor or gas under controlled conditions to achieve chemical reduction and metal interconnection. It is widely applied in advanced packaging, wafer bumping, RDL (Redistribution Layer), TSV (Through-Silicon Via) metallization, and wafer-level packaging (WLP). Although the term…
1. Basic Principle of Wire BondingIn modern electronic manufacturing, wire bonding is the most widely used interconnection method. It relies on solid-state welding, which means that metals are bonded together without reaching their melting temperature. This process is especially critical in semiconductor packaging, including advanced formats such as QFN packages. 2. Four Fundamental Factors of…
Model: Powernexx / ICONN / Rapid wire bonding machines – when the bonding area temperature fails to rise, the root cause is often a damaged heating rod. The machine will trigger the following error alarm in such cases.
RPM process monitoring alarms – generally, if the feature is not configured or enabled, and depending on the software version (as functions may vary slightly), the following alarms may occur.
Semiconductor Ceramic Chips: Properties, Manufacturing, Applications, and Future Trends IntroductionSemiconductor ceramic chips represent a unique class of electronic components that combine the electrical properties of semiconductors with the mechanical, chemical, and thermal advantages of ceramics. Featuring high-temperature resistance, excellent mechanical strength, and low dielectric loss, these chips are widely used in sensors, communications, power electronics,…
Root Causes & Analysis: Solution:Start with a simple reboot. If the issue repeats, proceed with cable re-check, cleaning, and software maintenance as outlined above.
Wire Bonder Repair Case – ERROR #2233 Error Description: Force system stepping alarm ERROR #2233 – Rail unbias motion failed.This error indicates an abnormal rail stepping motion, which prevents material bonding correction. Root Cause:The deviation between the MHS center point of the stepping material and the heating block center point was too large, resulting in…
Model: POWERNEXXFault Description: ERROR#2279 – Device Not Communicating The literal meaning indicates that the device status is not connected. From the fault description, it can be determined that the pneumatic board connection failed. After checking the hardware status, it was found that the air tube on the rear pneumatic board was loose, causing abnormal detection….
Chip Decapsulation: A Key Step in IC Failure Analysis and Reverse Engineering Chip decapsulation is a critical step in integrated circuit (IC) failure analysis (FA) and reverse engineering. Its purpose is to completely remove the encapsulating epoxy resin plastic (or other packaging materials) without damaging the internal chip structure, thereby exposing the die, bond wires,…
